MakerCon is set for New York in September. Cornell Engineering is presenting the MakerCon event.
Leaders of the maker movement will come together in New York for MakerCon, the week before World Maker Faire, September 17-18 at the New York Hall of Science (NYSCI). Presented by Cornell University College of Engineering, MakerCon provides valuable and practical insights into the impact of makers and making on education, the economy and emerging markets. Technology leaders Autodesk Fusion 360 and Intel have again signed on to support MakerCon, and are participating sponsors for the New York event.
MakerCon Two-Day Event
The two-day MakerCon conference will focus on four overarching themes: education, community, business and technology. Jumpstarting the conversation will be executives from organizations and educational institutions at the forefront of technology and maker initiatives that nurture the culture of entrepreneurship and innovation, core underpinnings of the maker movement.
Yancey Strickler, CEO of Kickstarter will open the conference, and Brian Krzanich, CEO of Intel will deliver the closing keynote. Other featured speakers include Massimo Banzi, co-founder of the Arduino Project; Dr. David R. Schneider, Cornell Engineering, founder of the Cornell Cup USA presented by Intel; Tim McNulty; VP of government affairs at Carnegie Mellon; and Jose Gomez-Marquez, principal medical device designer, Little Devices lab at MIT.
“Makers and the maker movement represent a slice of broader trends in today’s world. Makers come together for support and resources and access to tools. They share and learn from each other while also pursuing their individual projects,” said Dale Dougherty, CEO and founder of Maker Media, and publisher of Make: magazine and co-founder of Maker Faire. “MakerCon brings together the leaders at the forefront of the maker movement who want to share ideas and new insights into local and global manufacturing, design, workforce development, education and even creative culture.”
The first MakerCon, presented by Intel, was held at the Oracle Conference Center in Redwood City on May 13-14. The inaugural event was attended by over 500 representatives across the maker universe, from technology company executives, to educators, entrepreneurs, investors, librarians, makerspace coordinators, community organizers and local government officials among others.
In addition, many companies tapped the premiere MakerCon event to announce new products and projects. Carl Bass, CEO of Autodesk unveiled their new 3D printer; Mike Bell, vice president and general manager of Intel’s New Devices Group previewed the Intel® Edison development board; Zach Kaplan, CEO and founder of Inventables, revealed their new CNC mill; Massimo Banzi announced a collaboration with littleBits on an Arduino module; and GE launched its newest strategy for the First Build initiative.
“As the MakerCon event gains a foothold in the maker community, we expect to see more and more companies and organizations use the platform and captive audience of makers to make major announcements about new products and programs,” added Dougherty. “The MAKE brand caters to a universe of more than 25 million makers collectively across its Make: magazine, makezine.com, Maker Faires, and Maker Shed properties.
Other MakerCon sponsors include communications partner, Marketwired and media partner, Engadget.
For more details about the New York-based event and to register for MakerCon, go to makercon.com. Early bird registration is $495 for the two-day conference and is in effect until August 15, 2014.